US Patent Issued to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY on Oct. 21 for "Liquid cooling heat dissipation plate and liquid cooling electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,044, issued on Oct. 21, was assigned to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY Co. LTD. (Guangdong, China).

"Liquid cooling heat dissipation plate and liquid cooling electronic device" was invented by Qian Chen (Guangdong, China), Fangyu Liu (Guangdong, China), Yang Gao (Guangdong, China), Yuefeng Wu (Guangdong, China) and Haifeng Guo (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a liquid cooling heat dissipation plate and a liquid cooling electronic device, wherein the liquid cooling heat dissipation plate includes a cooling plate unit, a liquid inlet and a liquid outlet are provided at side walls of t...