US Patent Issued to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY on March 11 for "Layered series-connected power supply circuit and data processing device for supplying power to computing chips connected in series from bottommost layer to highest layer" (Chinese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,349, issued on March 11, was assigned to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China).

"Layered series-connected power supply circuit and data processing device for supplying power to computing chips connected in series from bottommost layer to highest layer" was invented by Yang Gao (Guangdong, China), Yuefeng Wu (Guangdong, China) and Zuoxing Yang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a series-connected power supply circuit and a data processing device. The series-connected power supply circuit comprises: at least two layers of to-be-powered chips (A1, A2.., Am...