ALEXANDRIA, Va., June 19 -- United States Patent no. D1,079,960, issued on June 17, was assigned to SHENZHEN LINGQIU TECHNOLOGY Co. LTD. (Shenzhen, China).
"Cupping device" was invented by Jianlin Li (Shenzhen, China).
The patent was filed on Feb. 21, 2024, under Application No. D/929,386.
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