US Patent Issued to SHENZHEN JUFEI OPTOELECTRONICS on May 27 for "Optical semiconductor element mounting package and optical semiconductor device using the same" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,657, issued on May 27, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD. (Shenzhen, China).

"Optical semiconductor element mounting package and optical semiconductor device using the same" was invented by Naoyuki Urasaki (Chikusei, Japan) and Kanako Yuasa (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The package has a recessed part served as an optical semiconductor element mounting region. The package includes a resin molding and at least two lead electrodes. The resin molding is composed of a thermoset...