US Patent Issued to SHENZHEN HONGHAI TECHNOLOGY on Aug. 5 for "Silicon carbide copper-plated gold-tin-preset heat sink structure and fabrication method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,126, issued on Aug. 5, was assigned to SHENZHEN HONGHAI TECHNOLOGY Co. LTD. (Guangdong, China).

"Silicon carbide copper-plated gold-tin-preset heat sink structure and fabrication method thereof" was invented by Jiandong Han (Guangdong, China), Hong Chen (Guangdong, China) and Shuo Yang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a silicon carbide copper-plated gold-tin-preset heat sink structure, including a silicon carbide substrate, a first copper plate, a second copper plate and a preset gold-tin layer, wherein the first copper plate is provided on a side of the silicon carbide substrate, the second copper plate i...