ALEXANDRIA, Va., Oct. 28 -- United States Patent no. D1,100,004, issued on Oct. 28, was assigned to shenzhen hennsery craft Ltd. (Shenzhen, China).
"Solder pad" was invented by Xiangman Chen (Guangdong, China).
The patent was filed on March 27, 2024, under Application No. D/934,802.
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