US Patent Issued to SHENZHEN EVERWIN PRECISION TECHNOLOGY on March 18 for "Board-to-board socket and board-to-board connector assembly" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,415, issued on March 18, was assigned to SHENZHEN EVERWIN PRECISION TECHNOLOGY Co. LTD. (Shenzhen, China).

"Board-to-board socket and board-to-board connector assembly" was invented by Yingyue Li (Guangdong, China), Gang Tian (Guangdong, China), Yiping Shi (Guangdong, China), Yayong Li (Guangdong, China) and Xinyun Peng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a board-to-board socket, including a socket body, socket terminal, and socket strengthener. The socket body includes a bottom wall, socket side walls, socket guide parts formed at lateral ends of the socket body, and an island part protruding upwards from t...