ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,675, issued on May 20, was assigned to Shenzhen Aowei Technology Co. LTD (Shenzhen, China).
"Material encapsulation device" was invented by Yuhao Liu (Guangdong, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The utility model relates to a material encapsulation device, including a base and an upper cover. The base is provided with a placing cavity for placing a container shell, and the upper cover is detachably and rotatably connected to the base. A top of the base is provided with a mounting part, and the upper cover is provided with a mounting groove that is matched with the mounting part. The mounting part is provided with a positioning st...