US Patent Issued to SHENYANG KINGSEMI on March 11 for "Wafer transfer device and wafer transfer method" (Chinese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,931, issued on March 11, was assigned to SHENYANG KINGSEMI Co. Ltd. (Shenyang, China).

"Wafer transfer device and wafer transfer method" was invented by Tianyao Wu (Shenyang, China), Hao Wang (Shenyang, China), Xinglong Chen (Shenyang, China) and Tao Miao (Shenyang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a wafer transfer device. The wafer transfer device comprises a first supporting mechanism and a second supporting mechanisms, wherein the first supporting mechanism and the second supporting mechanism are arranged side by side along a translation direction, and two opposite outer side walls of the first ...