ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,740, issued on Jan. 27, was assigned to SHENYANG KINGSEMI Co. Ltd. (Shenyang, China).
"Temperature compensation system, semiconductor device and temperature compensation method" was invented by Yuanbin Sun (Shenyang, China), Xinglong Chen (Shenyang, China), Yunhe Jiang (Shenyang, China) and Yu Han (Shenyang, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a temperature compensation system, including a cavity, a temperature feedback module, a heating plate, a main heating module, a multi-zone temperature control module, a distributed temperature control module and at least one auxiliary temperature adjustment module, wher...