ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,937, issued on Nov. 11, was assigned to SHENGYI TECHNOLOGY Co. LTD. (Dongguan, China).
"Resin composition and use thereof" was invented by Qing Wang (Dongguan, China), Qianfa Liu (Dongguan, China), Dongliang Liu (Dongguan, China), Jinchao Dong (Dongguan, China), Songgang Chai (Dongguan, China), Yongjing Xu (Dongguan, China) and Yanhua Zhang (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an org...