ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,067, issued on June 24, was assigned to ShengRongYuan(Suzhou) Technology Co. Ltd (Suzhou, China).
"Thin-plate loop heat pipe" was invented by Yongbin Mu (Suzhou, China) and Xiuhong Zhao (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thin-plate loop heat pipe comprises a housing including a first housing plate and a second housing plate that are relatively covered and sealed together at edges. An evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid channel are formed between the first housing plate and the second housing plate. The compensation chamber stores a ...