ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,768, issued on July 1, was assigned to SHENG CHUAN TECHNOLOGY Co. LTD. (Taoyuan, Taiwan).
"Wafer adsorption device" was invented by Hsin-Jung Peng (Taoyuan, Taiwan) and Tsung-Che Yu (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer adsorption device has a base, a guiding ring, and a cover. An inlet is formed through the base. The guiding ring is mounted on the base and includes a ring body and multiple bumps, the bumps protrude from a top surface of the ring body and are spaced from each other. Multiple flow channels are recessed from a surface of the cover, and each one of the flow channels is arc-shaped. An end of each one of ...