US Patent Issued to Sharp Semiconductor Innovation on May 27 for "Solid-state imaging element, camera module, image processing device, and imaging method" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,011, issued on May 27, was assigned to Sharp Semiconductor Innovation Corp. (Tenri, Japan).

"Solid-state imaging element, camera module, image processing device, and imaging method" was invented by Takeo Ushinaga (Tenri, Japan), Daisuke Funao (Tenri, Japan) and Tomonari Kenzaki (Tenri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging element synthesizes luminance signals and chrominance signals to obtain an image. The solid-state imaging element includes a plurality of first pixels and a plurality of second pixels. Each of the plurality of second pixels has a spectral response characteristic in white. The solid-state imagin...