US Patent Issued to Shanghai Tianma Micro-Electronics on May 27 for "Prefabricated substrate, flexible substrate, flexible module, fabrication method, and display device" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,643, issued on May 27, was assigned to Shanghai Tianma Micro-Electronics Co. Ltd. (Shanghai).

"Prefabricated substrate, flexible substrate, flexible module, fabrication method, and display device" was invented by Zhen Liu (Shanghai), Qingsan Zhu (Shanghai), Kerui Xi (Shanghai), Xiaobing Zhao (Wuhan, China), Huan Li (Shanghai), Fan Xu (Shanghai), Danping Wang (Shanghai) and Feng Qin (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a se...