ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,011, issued on Dec. 30, was assigned to Shanghai Tianma Micro-Electronics Co. Ltd. (Shanghai).
"Optical device package" was invented by Akira Fujita (Kanagawa, Japan), Futoshi Nakanishi (Kanagawa, Japan), Shingo Saigou (Kanagawa, Japan) and Nobuya Seko (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating subl...