US Patent Issued to SHANGHAI JIAOTONG UNIVERSITY on July 1 for "Multi-physical field measurement device for metal solidification process and housing thereof, and measurement method" (Chinese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,666, issued on July 1, was assigned to SHANGHAI JIAOTONG UNIVERSITY (Shanghai).

"Multi-physical field measurement device for metal solidification process and housing thereof, and measurement method" was invented by Jiao Zhang (Shanghai), Yang Tang (Shanghai), Ya Zhang (Shanghai), Yue Wu (Shanghai), Hui Xing (Shanghai), Baode Sun (Shanghai), Yanfeng Han (Shanghai), Yongbing Dai (Shanghai), Chaopeng Fu (Shanghai) and Qing Dong (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-physical field measurement device for a metal solidification process and a housing and a measurement method thereof are provided. The device includes: a sealed hous...