US Patent Issued to SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER on Feb. 3 for "On-chip all-solid-state supercapacitor and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,327, issued on Feb. 3, was assigned to SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER Co. LTD (Shanghai).

"On-chip all-solid-state supercapacitor and preparation method thereof" was invented by Bao Zhu (Shanghai), Rui Yin (Shanghai) and Wei Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An on-chip all-solid-state supercapacitor includes first electrode and second electrode, each including substrate, laminated structure, conductive thin film layer and solid electrolyte. Laminated structure is disposed on surface of substrate and has at least one deep trench structure; inner surface of deep trench structure has sacrificial ...