US Patent Issued to SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES on July 8 for "Preparation method for copper plate-covered silicon nitride ceramic substrate" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,524, issued on July 8, was assigned to SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES (Shanghai, Switzerland).

"Preparation method for copper plate-covered silicon nitride ceramic substrate" was invented by Xuejian Liu (Shanghai), Hui Zhang (Shanghai), Xiumin Yao (Shanghai), Yan Liu (Shanghai), Jindi Jiang (Shanghai), Zhengren Huang (Shanghai) and Zhongming Chen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A preparation method for a copper plate-covered silicon nitride ceramic substrate is provided. The structure of the copper plate-covered silicon nitride ceramic substrate includes a silicon nitride ceramic substrate, copper...