ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,911, issued on Feb. 17, was assigned to Shanghai Huahong Grace Semiconductor Manufacturing Corp. (Shanghai).

"OPC model simulation method" was invented by Xiaoliang Jin (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses an OPC model simulation method. The method includes the following steps: step 1, establishing a precision judgment function which is formed by multiplying each square of the difference between a simulation point of an OPC model and an actual point on a wafer, by weight, and then superposing all the squares; step 2, performing random data sampling, comprising forming distributed computing nodes;...