ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,161, issued on Dec. 16, was assigned to Shanghai AVIC OPTO Electronics Co. Ltd. (Shanghai).
"Functional component, forming method thereof and electronic device" was invented by Huijun Jin (Shanghai), Zhen Liu (Shanghai) and Mingyu Wang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "Functional component, forming method thereof and electronic device are provided. The functional component includes a packaging substrate and a connecting wire. The packaging substrate includes a through-hole wire-bonding area including a first insulating layer and a wire-bonding electrode sequentially formed on the substrate. The first insulating layer includes ...