US Patent Issued to SHANDONG YINGXIN COMPUTER TECHNOLOGIES on March 18 for "Heat dissipation and power supply module, and power supply frame" (Chinese Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,525, issued on March 18, was assigned to SHANDONG YINGXIN COMPUTER TECHNOLOGIES Co. LTD. (Shandong, China).

"Heat dissipation and power supply module, and power supply frame" was invented by Yunjie Yu (Shandong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a heat dissipating and power supply module and a power-supply shelf. The module includes: at least one fan, wherein a wind exiting side of the fan faces a power-supply shelf where the module is located; a first copper bar of a U-shaped structure and half encircling the fan; and a second copper bar electrically connected to two ends of the first copper bar...