US Patent Issued to Sercomm on Jan. 27 for "Heat dissipation module and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,457, issued on Jan. 27, was assigned to Sercomm Corp. (Taipei, Taiwan).

"Heat dissipation module and electronic device" was invented by ChengPu Wu (Taipei, Taiwan), Sheng-Yao Chen (Taipei, Taiwan) and Yi Fei Yu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a heat dissipation module and an electronic device. The heat dissipation module includes a thermally conductive plastic member and a metal member. The thermally conductive plastic member includes a base and a plurality of heat dissipation fins. The base includes an upper surface and a lower surface opposite to each other, and the heat dissipation fins are ar...