US Patent Issued to SEOYON E-HWA on Oct. 21 for "Battery pack cooling structure through applying variable thickness of gap filler" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,539, issued on Oct. 21, was assigned to SEOYON E-HWA Co. LTD. (Anyang, South Korea).

"Battery pack cooling structure through applying variable thickness of gap filler" was invented by Seok Hwan Hong (Anyang, South Korea) and Sung Su Kim (Suwon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A battery pack cooling structure includes a battery module having a structure in which a plurality of battery cells are electrically connected and are accommodated in a case, and a battery pack having a structure in which a plurality of battery modules are electrically connected to each other, wherein a gap filler made of a thermal conductive material...