ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,422, issued on Sept. 9, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea).
"Chip-scale package light emitting diode" was invented by Se Hee Oh (Ansan-si, South Korea), Jong Kyu Kim (Ansan-si, South Korea) and Joon Sub Lee (Ansan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and c...