ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,643, issued on May 27, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea).
"Flat bonding method of light emitting device and flat bonder for light emitting device" was invented by Ik Kyu You (Ansan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices."
The patent was filed on Nov. 20, 2023, under Application No. 18/514,969.
*For fu...