ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,773, issued on May 13, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea).

"Light-emitting device package and manufacturing method therefor" was invented by Yuriy Bilenko (Gyeonggi-do, South Korea) and Ki Yon Park (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting device package includes a substrate having a mounting region in which a light-emitting device chip is mounted. The light-emitting device package further includes a reflector and a cover enclosing the reflector. The reflector is disposed around the light-emitting device chip and having an opening through which the mounting region of the s...