ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,146, issued on Sept. 16, was assigned to SEOUL SEMICONDUCTOR Co. LTD. (Ansan-si, South Korea).
"Light emitting diode package" was invented by Seung Ri Choi (Ansan-si, South Korea), Hyuck Jun Kim (Ansan-si, South Korea), Se Min Bang (Ansan-si, South Korea), Do Choul Woo (Ansan-si, South Korea) and Se Won Tae (Ansan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of l...