ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,958, issued on Jan. 28, was assigned to SEOUL SEMICONDUCTOR Co. LTD. (Ansan-si, South Korea).
"Light emitting diode package having lead frame with groove thereof" was invented by Ji Ho Kim (Ansan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed t...