US Patent Issued to SEOUL SEMICONDUCTOR on Dec. 23 for "Wafer-level light emitting diode package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,512, issued on Dec. 23, was assigned to SEOUL SEMICONDUCTOR Co. LTD. (Ansan-si, South Korea).

"Wafer-level light emitting diode package and method of fabricating the same" was invented by Won Cheol Seo (Ansan-si, South Korea) and Dae Sung Cho (Ansan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arra...