US Patent Issued to Seoul National Unviversity R&DB Foundation on Feb. 10 for "Snap-through joint module and soft robot including same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,912, issued on Feb. 10, was assigned to Seoul National Unviversity R&DB Foundation (Seoul, South Korea).

"Snap-through joint module and soft robot including same" was invented by Ho-Young Kim (Seoul, South Korea) and Ji-Sung Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A snap-through joint module is provided. The snap-through joint module includes a first member having a first internal space to which pneumatic pressure is applied, a second member having a second internal space to which pneumatic pressure is applied, a snap joint portion configured to connect the first member to the second member and capable of a snap-throu...