ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,553, issued on Dec. 9, was assigned to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (Seoul, South Korea).
"3D synapse device stack, 3D stackable synapse array using the 3D synapse device stacks and method of fabricating the stack" was invented by Jong-Ho Lee (Seoul, South Korea), Young-tak Seo (Seongnam-si, South Korea), Soochang Lee (Seoul, South Korea), Seongbin Oh (Seoul, South Korea) and Jangsaeng Kim (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a 3D synapse device stack, a 3D stackable synapse array using the same, and a method for manufacturing the 3D synapse device stack. The 3D synapse device stack comprises: a ...