ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,982, issued on May 13, was assigned to Seong-Jun Kim (South Korea).
"Cable mold" was invented by Seong-jun Kim (Siheung-si, South Korea) and Sung-shik Kim (Gwangmyeong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a cable mold for organizing and protecting indoor cable such as an electric wire or communication wire, and specifically, provides a cable mold comprising: a bottom part tightly adhering to a floor and receiving cable on top of the bottom part; a cover part for covering the upper side of the bottom part, and receiving the cable under the cover part; a connection part for integrally connecti...