US Patent Issued to SENTEC E&E on Sept. 16 for "Low parasitic inductance power module featuring staggered interleaving conductive members" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,967, issued on Sept. 16, was assigned to SENTEC E&E Co. LTD. (Taoyuan, Taiwan).

"Low parasitic inductance power module featuring staggered interleaving conductive members" was invented by Jason An Cheng Huang (Taoyuan, Taiwan), Kun-Tzu Chen (Taoyuan, Taiwan), Liang-Yo Chen (Taoyuan, Taiwan), Nai-His Hu (Taoyuan, Taiwan) and Siao-Deng Huang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low parasitic inductance power module featuring staggered interleaving conductive members, including: at least one base extending in a length direction; a substrate on which at least one input bus bar and at least one output bus bar are provided; a...