US Patent Issued to Sensortek Technology on Aug. 26 for "Complex sensing device packaging structure and packaging method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,431, issued on Aug. 26, was assigned to Sensortek Technology Corp. (Jhubei, Taiwan).

"Complex sensing device packaging structure and packaging method" was invented by Wen-Chieh Tsou (Jhubei, Taiwan) and Yi-Hua Chang (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A complex sensing device packaging structure and packaging method are disclosed. The packaging structure includes a substrate disposed with a light emitting element and a light sensing chip. A first non-transparent material is disposed on the light sensing chip. A transparent molding material surrounds the light emitting element, the light sensing chip and the first non-trans...