US Patent Issued to Senseonics on Oct. 21 for "Enclosure for a wireless implantable device with embedded power source" (Maryland Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,446,795, issued on Oct. 21, was assigned to Senseonics Inc. (Germantown, Md.).

"Enclosure for a wireless implantable device with embedded power source" was invented by Andrew DeHennis (Germantown, Md.), Abhi Chavan (Germantown, Md.), James Masciotti (Germantown, Md.), Bryan Hays (Germantown, Md.), Yahya Hosseini (Germantown, Md.) and Erman Citirik (Germantown, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An implantable device including a housing, circuitry within the housing, and a power source attached to the housing and electrically connected to the circuitry. The device may include electrically conductive connectors configured to electrically c...