US Patent Issued to Senko Advanced Components on July 1 for "Metallized optical fiber array module and fabrication method thereof" (California Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,923, issued on July 1, was assigned to Senko Advanced Components Inc. (Hudson, Mass.).

"Metallized optical fiber array module and fabrication method thereof" was invented by Robert Ryan Vallance (Newbury Park, Calif.) and Yang Chen (Thousand Oaks, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array modu...