ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,607, issued on Sept. 30, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Flux and solder paste" was invented by Shuta Akatsuka (Tokyo), Kengo Ohta (Tokyo), Sakie Okada (Tokyo) and Yutaka Hashimoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flux containing: a rosin; a solvent (S); a thixotropic agent; and an activator is disclosed. The rosin contains a rosin amine. The solvent (S) contains a first solvent (S1) having a boiling point of 250deg C. or less, and the amount of the first solvent (S1) relative to the total amount of the solvent (S) is 50% by mass or more and 100% by mass or less."
The patent was filed on June 7, 2022,...