ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,316, issued on Oct. 7, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Soldering apparatus" was invented by Yasuji Kawashima (Osaka, Japan), Hiroshi Taguchi (Tokyo), Kyoko Kuramoto (Tokyo), Henri Hanzawa (Tokyo), Tomotake Kagaya (Tokyo) and Katsuhiro Shinohara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510."
Th...