ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,060, issued on Nov. 4, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Solder paste" was invented by Ryuji Ukai (Tokyo), Kengo Ohta (Tokyo), Sakie Okada (Tokyo) and Kazuya Kitazawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder paste includes a solder powder and a flux. The flux includes a rosin, an activator, a solvent, and a thixotropic agent containing a polyethylene glycol. A content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, and a content o...