ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,051, issued on Nov. 25, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Flux and solder paste" was invented by Ryo Saito (Tokyo), Tomoko Nagai (Tokyo), Tetsu Takemasa (Tokyo), Kazuyori Takagi (Tokyo), Yutaka Hashimoto (Tokyo), Nanako Miyagi (Tokyo), Mutsuki Kaneko (Tokyo), Megumi Hayakawa (Tokyo) and Tsuyoshi Masaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flux containing rosin, a solvent, a thixotropic agent, an amine hydroiodide, and an activator (provided that the amine hydroiodide is excluded), in which the amine hydroiodide includes a heteroalicyclic amine hydroiodide, is provided in the present invention. As the heteroal...