US Patent Issued to SENJU METAL INDUSTRY on March 25 for "Joining material, production method for joining material, and joined body" (Japanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,622, issued on March 25, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).

"Joining material, production method for joining material, and joined body" was invented by Jinting Jiu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 micro metre or less is adopted."

The patent was filed on Oct. 14, 2020, under Application No. ...