ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,054, issued on July 22, was assigned to SENJU METAL INDUSTRY Co. LTD..
"Flux and solder paste" was invented by Tomohisa Kawanago (Tokyo), Yasuhiro Kajikawa (Tokyo) and Atsushi Ikeda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of decrease in weight of 20% by mass or less in a case of being held at 140deg C. for 15 minutes. S1 has a rate of decrease in weight of 50% by mass or less in a case of being held at 140deg C. for 15 minutes."
The patent was filed on Oct. 4, 2022, under Application No. 18/694,47...