ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,862, issued on Feb. 10, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Flux and solder paste" was invented by Hiroyoshi Kawasaki (Tokyo), Masato Shiratori (Tokyo), Kazuhiro Minegishi (Tokyo) and Yuji Kawamata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flu...