ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,960, issued on May 6, was assigned to Semtech Corp. (Camarillo, Calif.).
"Side-solderable leadless package" was invented by Henry Descalzo Bathan (Thousand Oaks, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer."
The patent was filed on Sept. 28, 2023, under Application No. 18/476,356.
*For further information, in...