ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,075, issued on March 25, was assigned to SEMSYSCO GMBH (Salzburg, Austria).
"Substrate handling device for a wafer" was invented by Andreas Gleissner (Dobriach, Austria), Manuel Eibl (Krispl, Austria) and Herbert Oetzlinger (Hallwang, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: -an end effector, -a straightening ring, and -a suction cup. The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the ...