US Patent Issued to SEMITEC on Dec. 30 for "Electronic component, lead part connection structure, and lead part connection method" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,421, issued on Dec. 30, was assigned to SEMITEC Corp. (Tokyo).

"Electronic component, lead part connection structure, and lead part connection method" was invented by Mitsutoshi Ogura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part (3) made of a conductor and a conductive wire (5) made of a plurality of core wires (52) are connected to each other through welding, wherein the lead part (3) and the conductive wire (5) are co...