US Patent Issued to SEMIKRON ELEKTRONIK on July 22 for "Power semiconductor module having a substrate, power semiconductor components and having a DC voltage connection device" (German Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,385, issued on July 22, was assigned to SEMIKRON ELEKTRONIK GMBH & Co. KG (Nuremberg, Germany).

"Power semiconductor module having a substrate, power semiconductor components and having a DC voltage connection device" was invented by Johannes Klier (Amberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module has a substrate that has an electrically non-conductive insulating layer and a first metal layer on the insulating layer and forms conductor tracks, with power semiconductor components arranged on the first metal layer and electrically connected to the first metal layer and having a DC voltage connection device th...