US Patent Issued to SEMIKRON ELEKTRONIK on July 15 for "Power semiconductor module having a substrate arrangement, having power semiconductor components and having a foil stack arrangement" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,312, issued on July 15, was assigned to SEMIKRON ELEKTRONIK GMBH & Co. KG (Nuremberg, Germany).

"Power semiconductor module having a substrate arrangement, having power semiconductor components and having a foil stack arrangement" was invented by Ingo Bogen (Nuremberg, Germany) and Stefan Oehling (Uttenreuth, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module has a substrate arrangement which has a substrate, wherein the respective substrate has conductor tracks, power semiconductor components arranged on the substrate conductor tracks and electrically conductively contacted therewith, a foil stack arrangement which ...