US Patent Issued to SEMIGHT INSTRUMENTS on Feb. 4 for "Chip test pressing-down apparatus and formation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,216,156, issued on Feb. 4, was assigned to SEMIGHT INSTRUMENTS Co. LTD (Suzhou, China).

"Chip test pressing-down apparatus and formation method thereof" was invented by Zhe Lian (Suzhou, China), Jianjun Huang (Suzhou, China), Yonghong Wu (Suzhou, China), Shan Zhao (Suzhou, China) and Haiyang Hu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below...